Chen Fan

1. ZONG, Baiqing, DUAN, Xiangyang, FAN, Chen, GUAN, Ke. 6G technologies - opportunities and challenges. V: Proceedings of IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA), Nanjing, China : 23-25 November 2020. Danvers: IEEE= Institute of Electrical and Electronics Engineers. Str. 171-172. ISBN 978-1-7281-8030-4, ISBN 978-1-7281-8032-8. https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9332024. [COBISS.SI-ID 76738563]

2. FAN, Chen, KOZJEK, Dominik, PORTER, Conor, CAO, Jian. Acceleration of powder-bed-size thermal simulation considering scanning-path-scale through a pseudo-layer-wise equivalent heat flux model. Journal of manufacturing processes. [Online ed.]. 2025, vol. 134, str. 394-409, ilustr. ISSN 2212-4616. https://www.sciencedirect.com/science/article/pii/S1526612524013379, Repozitorij Univerze v Ljubljani – RUL, DOI: 10.1016/j.jmapro.2024.12.057. [COBISS.SI-ID 221502979]